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80960SA 参数 Datasheet PDF下载

80960SA图片预览
型号: 80960SA
PDF下载: 下载PDF文件 查看货源
内容描述: 16位突发数据总线的嵌入式32位微处理器 [EMBEDDED 32-BIT MICROPROCESSOR WITH 16-BIT BURST DATA BUS]
分类和应用: 微处理器
文件页数/大小: 39 页 / 369 K
品牌: INTEL [ INTEL ]
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80960SA  
EMBEDDED 32-BIT MICROPROCESSOR  
WITH 16-BIT BURST DATA BUS  
CONTENTS  
PAGE  
1.0 THE i960® PROCESSOR ...........................................................................................................................1  
1.1 Key Performance Features .................................................................................................................2  
1.1.1 Memory Space And Addressing Modes ...................................................................................4  
1.1.2 Data Types ...............................................................................................................................4  
1.1.3 Large Register Set ...................................................................................................................4  
1.1.4 Multiple Register Sets ..............................................................................................................5  
1.1.5 Instruction Cache .....................................................................................................................6  
1.1.6 Register Scoreboarding ...........................................................................................................6  
1.1.7 High Bandwidth Bus ................................................................................................................6  
1.1.8 Interrupt Handling ....................................................................................................................6  
1.1.9 Debug Features .......................................................................................................................6  
1.1.10 Fault Detection .......................................................................................................................7  
1.1.11 Built-in Testability ....................................................................................................................7  
1.1.12 CHMOS ..................................................................................................................................7  
2.0 ELECTRICAL SPECIFICATIONS............................................................................................................. 11  
2.1 Power and Grounding ....................................................................................................................... 11  
2.2 Power Decoupling Recommendations .............................................................................................. 11  
2.3 Connection Recommendations ......................................................................................................... 11  
2.4 Characteristic Curves ....................................................................................................................... 11  
2.5 Test Load Circuit ...............................................................................................................................13  
2.6 ABSOLUTE MAXIMUM RATINGS* ..................................................................................................14  
2.7 DC Characteristics ............................................................................................................................14  
2.8 AC Specifications ..............................................................................................................................15  
3.0 MECHANICAL DATA................................................................................................................................21  
3.1 Packaging .........................................................................................................................................21  
3.2 Pin Assignment .................................................................................................................................21  
3.3 Pinout ................................................................................................................................................23  
3.4 Package Thermal Specifications ......................................................................................................27  
3.5 Stepping Register Information ..........................................................................................................27  
4.0 WAVEFORMS...........................................................................................................................................28  
5.0 REVISION HISTORY ................................................................................................................................34  
ii  
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