®
MOBILE PENTIUM PROCESSOR WITH MMX™ TECHNOLOGY
Table 28. TCP Thermal Resistance without Enhancements
qJC
qCA
(°C/Watt)
(°C/Watt)
Thermal Resistance without
Enhancements
0.8
14
Table 29. TCP Thermal Resistance with Enhancements (Without Airflow)
qCA
(°C/W)
Thermal
Enhancements
Notes
Heat sink
Al Plate
11.7
8.7
1.2"´ 1.2"´ .35"
4"´ 4"´ .030"
Al Plate with Heat Pipe
7.8
0.3”´ 1"´ 4" Heat pipe
4”x4”x0.3” Al plate
Table 30. TCP Thermal Resistance with Enhancements (With Airflow)
Thermal
Enhancements
qCA
(°C/W)
Notes
1.2"´ 1.2"´ .35" HS
1"´ 1"´ .4" Fan
Heat sink with Fan @ 1.7 CFM
Heat sink with Airflow @ 400 LFM
Heat sink with Airflow @ 600 LFM
5.0
5.1
4.3
1.2”x1.2”x.35” HS
1.2"´ 1.2"´ .35" HS
NOTES:
HS = heat sink
LFM = Linear Feet/Minute
CFM = Cubic Feet/Minute
66
INTEL [ INTEL ]
