欢迎访问ic37.com |
会员登录 免费注册
发布采购

631XESB 参数 Datasheet PDF下载

631XESB图片预览
型号: 631XESB
PDF下载: 下载PDF文件 查看货源
内容描述: [Multifunction Peripheral, CMOS, PBGA641, 40 X 40 MM, MICRO, BGA-641]
分类和应用:
文件页数/大小: 106 页 / 3572 K
品牌: INTEL [ INTEL ]
 浏览型号631XESB的Datasheet PDF文件第2页浏览型号631XESB的Datasheet PDF文件第3页浏览型号631XESB的Datasheet PDF文件第4页浏览型号631XESB的Datasheet PDF文件第5页浏览型号631XESB的Datasheet PDF文件第7页浏览型号631XESB的Datasheet PDF文件第8页浏览型号631XESB的Datasheet PDF文件第9页浏览型号631XESB的Datasheet PDF文件第10页  
Tables  
1
2
3
4
5
References ..............................................................................................................11  
Voltage Identification Definition..................................................................................15  
Absolute Maximum and Minimum Ratings ....................................................................17  
Voltage and Current Specification ...............................................................................18  
VCC Static and Transient Tolerance for 775_VR_CONFIG_05A (Mainstream)  
and for 775_VR_CONFIG_06 Processors ......................................................................20  
VCC Overshoot Specifications......................................................................................21  
FSB Signal Groups....................................................................................................23  
Signal Characteristics................................................................................................24  
Signal Reference Voltages .........................................................................................24  
6
7
8
9
10 GTL+ Signal Group DC Specifications ..........................................................................25  
11 GTL+ Asynchronous Signal Group DC Specifications......................................................25  
12 PWRGOOD and TAP Signal Group DC Specifications.......................................................26  
13 VTTPWRGD DC Specifications.....................................................................................27  
14 BSEL[2:0] and VID[5:0] DC Specifications...................................................................27  
15 BOOTSELECT DC Specifications ..................................................................................27  
16 GTL+ Bus Voltage Definitions.....................................................................................28  
17 Core Frequency to FSB Multiplier Configuration.............................................................29  
18 BSEL[2:0] Frequency Table for BCLK[1:0] ...................................................................30  
19 Front Side Bus Differential BCLK Specifications.............................................................32  
20 Processor Loading Specifications.................................................................................37  
21 Package Handling Guidelines......................................................................................37  
22 Processor Materials...................................................................................................38  
23 Alphabetical Land Assignments...................................................................................44  
24 Numerical Land Assignment.......................................................................................54  
25 Signal Description (Sheet 1 of 9)................................................................................64  
26 Processor Thermal Specifications for 775_VR_CONFIG_05A Processors............................76  
27 Processor Thermal Specifications for 775_VR_CONFIG_06 Processors..............................76  
28 Thermal Profile for 775_VR_CONFIG_05A Processors.....................................................77  
29 Thermal Profile for 775_VR_CONFIG_06 Processors ......................................................78  
30 Thermal “Diode” Parameters using Diode Model............................................................83  
31 Thermal “Diode” Parameters using Transistor Model......................................................83  
32 Thermal “Diode” ntrim and Diode_Correction_Offset.......................................................84  
33 Thermal Diode Interface............................................................................................84  
34 Power-On Configuration Option Signals .......................................................................85  
35 Fan Heatsink Power and Signal Specifications...............................................................92  
36 TMA Power and Signal Specifications.........................................................................100  
37 TMA Set Points for 3-wire operation of BTX Type I and Type II Boxed Processors ............103  
§
6
Datasheet  
 复制成功!