5.2.5 THERMTRIP# Signal................................................................................82
5.2.6 TCONTROL and Fan Speed Reduction ...........................................................82
5.2.7 Thermal Diode........................................................................................82
6
Features..............................................................................................................85
6.1
6.2
Power-On Configuration Options ..........................................................................85
Clock Control and Low Power States.....................................................................85
6.2.1 Normal State .........................................................................................86
6.2.2 HALT and Enhanced HALT Powerdown States..............................................86
6.2.2.1 HALT Powerdown State ..............................................................86
6.2.2.2 Enhanced HALT Powerdown State................................................87
6.2.3 Stop Grant State ....................................................................................87
6.2.4 Enhanced HALT Snoop or HALT Snoop State,
Stop Grant Snoop State...........................................................................88
6.2.4.1 HALT Snoop State, Stop Grant Snoop State ..................................88
6.2.4.2 Enhanced HALT Snoop State.......................................................88
7
8
Boxed Processor Specifications........................................................................89
7.1
Mechanical Specifications....................................................................................89
7.1.1 Boxed Processor Cooling Solution Dimensions.............................................89
7.1.2 Boxed Processor Fan Heatsink Weight .......................................................91
7.1.3 Boxed Processor Retention Mechanism and Heatsink
Attach Clip Assembly...............................................................................91
Electrical Requirements ......................................................................................91
7.2.1 Fan Heatsink Power Supply ......................................................................91
Thermal Specifications........................................................................................93
7.3.1 Boxed Processor Cooling Requirements......................................................93
7.2
7.3
Balanced Technology Extended (BTX) Boxed Processor Specifications.....95
8.1
Mechanical Specifications....................................................................................96
8.1.1 Balanced Technology Extended (BTX) Type I and
Type II Boxed Processor Cooling Solution Dimensions..................................96
8.1.2 Boxed Processor Thermal Module Assembly Weight .....................................98
8.1.3 Boxed Processor Support and Retention Module (SRM) ................................98
Electrical Requirements ......................................................................................99
8.2.1 Thermal Module Assembly Power Supply....................................................99
Thermal Specifications......................................................................................101
8.3.1 Boxed Processor Cooling Requirements....................................................101
8.3.2 Variable Speed Fan...............................................................................102
8.2
8.3
9
Debug Tools Specifications..............................................................................105
9.1
Logic Analyzer Interface (LAI) ...........................................................................105
9.1.1 Mechanical Considerations .....................................................................105
9.1.2 Electrical Considerations........................................................................105
4
Datasheet
INTEL [ INTEL ]
