欢迎访问ic37.com |
会员登录 免费注册
会员中心
企业资讯   人才招聘  
电子百科

电子百科

Datasheet下载 IC品牌 缩略语 技术文章 IC型号

产品导航

ABCDEFGHIJKLMNOPQRSTUVWXYZ0123456789
PDF
  • 产品
  • PDF

    • 最近搜索

    热门搜索

    搜索
    发布采购

    631XESB 参数 Datasheet PDF下载

    631XESB图片预览
    型号： 631XESB
    PDF下载： 下载PDF文件 查看货源
    内容描述： [Multifunction Peripheral, CMOS, PBGA641, 40 X 40 MM, MICRO, BGA-641]
    分类和应用：
    文件页数/大小： 106 页 / 3572 K
    品牌： INTEL [ INTEL CORPORATION ]
     浏览型号631XESB的Datasheet PDF文件第1页浏览型号631XESB的Datasheet PDF文件第2页浏览型号631XESB的Datasheet PDF文件第3页浏览型号631XESB的Datasheet PDF文件第4页浏览型号631XESB的Datasheet PDF文件第6页浏览型号631XESB的Datasheet PDF文件第7页浏览型号631XESB的Datasheet PDF文件第8页浏览型号631XESB的Datasheet PDF文件第9页  
    Figures
    1
    2
    3
    4
    5
    6
    7
    8
    9
    10
    11
    12
    13
    14
    15
    16
    17
    18
    19
    20
    21
    22
    23
    24
    25
    26
    27
    28
    29
    30
    31
    32
    V
    CC
    Static and Transient Tolerance for 775_VR_CONFIG_05A (Mainstream)
    and for 775_VR_CONFIG_06 Processors...................................................................... 21
    V
    CC
    Overshoot Example Waveform ............................................................................. 22
    Phase Lock Loop (PLL) Filter Requirements .................................................................. 31
    Processor Package Assembly Sketch ........................................................................... 33
    Processor Package Drawing Sheet 1 of 3 ..................................................................... 34
    Processor Package Drawing Sheet 2 of 3 ..................................................................... 35
    Processor Package Drawing Sheet 3 of 3 ..................................................................... 36
    Processor Top-Side Markings Example ........................................................................ 38
    Processor Land Coordinates and Quadrants (Top View) ................................................. 39
    land-out Diagram (Top View – Left Side) ..................................................................... 42
    land-out Diagram (Top View – Right Side) ................................................................... 43
    Thermal Profile for 775_VR_CONFIG_05A Processors .................................................... 77
    Thermal Profile for 775_VR_CONFIG_06 Processors ...................................................... 78
    Case Temperature (TC) Measurement Location ............................................................ 79
    Thermal Monitor 2 Frequency and Voltage Ordering ...................................................... 81
    Processor Low Power State Machine ........................................................................... 86
    Mechanical Representation of the Boxed Processor ....................................................... 89
    Space Requirements for the Boxed Processor (Side View; applies to all four side views) .... 90
    Space Requirements for the Boxed Processor (Top View)............................................... 90
    Space Requirements for the Boxed Processor (Overall View) .......................................... 91
    Boxed Processor Fan Heatsink Power Cable Connector Description .................................. 92
    Baseboard Power Header Placement Relative to Processor Socket ................................... 93
    Boxed Processor Fan Heatsink Airspace Keep-out Requirements
    (Side 1 View) .......................................................................................................... 94
    Boxed Processor Fan Heatsink Airspace Keep-out Requirements
    (Side 2 View) .......................................................................................................... 94
    Mechanical Representation of the Boxed Processor with a Type I TMA ............................. 95
    Mechanical Representation of the Boxed Processor with a Type II TMA ............................ 96
    Requirements for the Balanced Technology Extended (BTX) Type I Keep-out Volumes ....... 97
    Requirements for the Balanced Technology Extended (BTX) Type II Keep-out Volume ....... 98
    Assembly Stack Including the Support and Retention Module ......................................... 99
    Boxed Processor TMA Power Cable Connector Description ............................................ 100
    Balanced Technology Extended (BTX) Mainboard Power Header Placement
    (Hatched Area) ...................................................................................................... 101
    Boxed Processor TMA Set Points............................................................................... 102
    Datasheet
    5

    IC37:专业IC行业平台

    专业IC领域供求交易平台:提供全面的IC Datasheet资料和资讯，Datasheet 1000万数据，IC品牌1000多家。

    网站导航 Datasheet资料库 电子术语 电子百科
    服务中心 常见问题 委托交易 会员服务
    关于我们 公司简介 联系我们 免责申明

    产品索引：ABCDEFGHIJKLMNOPQRSTUVWXYZ0123456789

    深圳网络警察报警平台 公共信息安全网络监察 经营性网站备案信息 不良信息举报中心 工商网监电子标识 全国公安机关备案
    服务电话： 0755-32882616 0755-32882606 0755-32882608 0755-32882607 值班和投诉电话：13715251531 ©2004-2024 IC37网 版权所有：ic37.com 版权申明 公网安备44030402000606 粤ICP备13051289号-6