Balanced Technology Extended (BTX) Boxed Processor Specifications
Figure 31.
Balanced Technology Extended (BTX) Mainboard Power Header Placement
(Hatched Area)
8.3
Thermal Specifications
This section describes the cooling requirements of the thermal module assembly
solution used by the boxed processor.
8.3.1
Boxed Processor Cooling Requirements
The boxed processor may be directly cooled with a TMA. However, meeting the
processor's temperature specification is also a function of the thermal design of the
entire system, and ultimately the responsibility of the system integrator. The processor
case temperature specification is in Chapter 5. The boxed processor TMA is able to
keep the processor temperature within the specifications in Table 26 for chassis that
provide good thermal management. For the boxed processor TMA to operate properly,
it is critical that the airflow provided to the TMA is unimpeded. Airflow of the TMA is into
the duct and out of the rear of the duct in a linear flow. Blocking the airflow to the TMA
inlet reduces the cooling efficiency and decreases fan life. Filters will reduce or impede
airflow which will result in a reduced performance of the TMA. The air temperature
entering the fan should be kept below 35.5°C. Again, meeting the processor's
temperature specification is the responsibility of the system integrator.
Datasheet
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INTEL [ INTEL ]
