Thermal Specifications
Figure 6-1.
Dual-Core Intel Xeon Processor 5000 Series (1066 MHz) Thermal Profiles A
and B
TCASE_M AX is a thermal solution design point. In actuality, units will not significantly
exceed TCASE_M AX_A due to TCC activation.
85
80
75
70
Tcase [C]
65
60
55
50
45
40
0
10
20
30
40
50
60
70
80
90
100
110
120
130
Pow e r [W]
TCASE_MAX_B@ TDP
TCASE_MAX_A@ TDP
Thermal Profile B
Y = 0.260*x + 44.2
Thermal Profile A
Y = 0.203*x + 42.6
Notes:
1.
Thermal Profile A is representative of a volumetrically unconstrained platform. Please refer to
for
discrete points that constitute the thermal profile.
2.
Implementation of Thermal Profile A should result in virtually no TCC activation. Furthermore, utilization of
thermal solutions that do not meet processor Thermal Profile A will result in increased probability of TCC
activation and may incur measurable performance loss. (Refer to
for details on TCC activation.)
3.
Thermal Profile B is representative of a volumetrically constrained platform. Please refer to
for
discrete points that constitute the thermal profile.
4.
Implementation of Thermal Profile B will result in increased probability of TCC activation and measurable
performance loss. Furthermore, utilization of thermal solutions that do not meet Thermal Profile B do not
meet the processor’s thermal specifications and may result in permanent damage to the processor.
5.
Refer to the
Dual-Core Intel
®
Xeon
®
processor 5000 Series Thermal/Mechanical Design Guidelines
for
system and environmental implementation details.
Table 6-2.
Dual-Core Intel Xeon Processor 5000 Series (1066 MHz) Thermal Profile A
Table
Power (W)
P_profile_min
_A
=36.5
40
45
50
55
60
65
70
75
80
T
CASE_MAX
(° C)
50.0
50.7
51.7
52.8
53.8
54.8
55.8
56.8
57.8
58.8
Power (W)
85
90
95
100
105
110
115
120
125
130
T
CASE_MAX
(° C)
59.9
60.9
61.9
62.9
63.9
64.9
65.9
67.0
68.0
69.0
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet
71
INTEL [ INTEL CORPORATION ]
