Thermal Specifications
and
is indicative of a constrained thermal environment
(that is, 1U form factor). Because of the reduced cooling capability represented by this
thermal solution, the probability of TCC activation and performance loss is increased.
Additionally, utilization of a thermal solution that does not meet Thermal Profile B will
violate the thermal specifications and may result in permanent damage to the
processor. Intel has developed these thermal profiles to allow OEMs to choose the
thermal solution and environmental parameters that best suit their platform
implementation. Refer to the
Dual-Core Intel
®
Xeon
®
Processor 5000 Series Thermal/
Mechanical Design Guidelines
for details on system thermal solution design, thermal
profiles and environmental considerations.
The Dual-Core Intel Xeon Processor 5063 (MV) supports a single Thermal Profile
targeted at volumetrically constrained thermal environments (for example, blades, 1U
form factors.) With this Thermal Profile, it’s expected that the Thermal Control Circuit
(TCC) would only be activated for very brief periods of time when running the most
power-intensive applications. Refer to the
Dual-Core Intel
®
Xeon
®
Processor 5000
Series Thermal/Mechanical Design Guidelines
for further details.
The upper point of the thermal profile consists of the Thermal Design Power (TDP)
defined in
and the associated T
CASE
value. It should be
noted that the upper point associated with Thermal Profile B (x = TDP and y =
T
CASE_MAX_B
@ TDP) represents a thermal solution design point. In actuality the
processor case temperature will not reach this value due to TCC activation (refer to
and
The lower point of the thermal profile consists of x =
P_profile_min and y = T
CASE_MAX
@ P_profile_min. P_profile_min is defined as the
processor power at which T
CASE
, calculated from the thermal profile, is equal to 50
°
C.
The case temperature is defined at the geometric top center of the processor IHS.
Analysis indicates that real applications are unlikely to cause the processor to consume
maximum power dissipation for sustained time periods. Intel recommends that
complete thermal solution designs target the Thermal Design Power (TDP) indicated in
and
instead of the maximum processor power
consumption. The Thermal Monitor feature is intended to help protect the processor in
the event that an application exceeds the TDP recommendation for a sustained time
period. For more details on this feature, refer to
To ensure maximum
flexibility for future requirements, systems should be designed to the Flexible
Motherboard (FMB) guidelines, even if a processor with lower power dissipation is
currently planned.
The Thermal Monitor feature must be enabled for the
processor to remain within its specifications.
Table 6-1.
Dual-Core Intel Xeon Processor 5000 Series (1066 MHz) Thermal
Specifications
Core Frequency
Launch to FMB
Thermal
Design Power
(W)
130
Minimum
T
CASE
(°C)
5
Maximum T
CASE
(°C)
Refer to
Notes
1, 2, 3, 4, 5
Notes:
1.
These values are specified at V
CC_MAX
for all processor frequencies. Systems must be designed to ensure
the processor is not to be subjected to any static V
CC
and I
CC
combination wherein V
CC
exceeds V
CC_MAX
at
specified I
CC
. Please refer to the loadline specifications in
2.
Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
CASE
.
3.
These specifications are based on final silicon validation/characterization.
4.
Power specifications are defined at all VIDs found in
The Dual-Core Intel Xeon Processor 5000
series may be shipped under multiple VIDs for each frequency.
5.
FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
70
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet
INTEL [ INTEL CORPORATION ]
