欢迎访问ic37.com |
会员登录 免费注册
发布采购

370 参数 Datasheet PDF下载

370图片预览
型号: 370
PDF下载: 下载PDF文件 查看货源
内容描述: 90纳米制程的赛扬M处理器 [Celeron M Processor on 90 nm Process]
分类和应用:
文件页数/大小: 68 页 / 864 K
品牌: INTEL [ INTEL ]
 浏览型号370的Datasheet PDF文件第1页浏览型号370的Datasheet PDF文件第2页浏览型号370的Datasheet PDF文件第3页浏览型号370的Datasheet PDF文件第5页浏览型号370的Datasheet PDF文件第6页浏览型号370的Datasheet PDF文件第7页浏览型号370的Datasheet PDF文件第8页浏览型号370的Datasheet PDF文件第9页  
Figures  
1
2
Clock Control States .................................................................................................11  
Illustration of Deep Sleep State VCC Static and Ripple Tolerances  
for the Celeron M Processor (Deep Sleep State): VID=1.260 V .......................................22  
Illustration of Active State VCC Static and Ripple Tolerances  
for the Celeron M Processor ULV: VID=0.940 V ............................................................24  
Illustration of Deep Sleep State VCC Static and Ripple Tolerances  
for the Celeron M Processor ULV: VID=0.940 V ............................................................25  
Active VCC and ICC Loadline for the Celeron M Processor:  
Standard Voltage and Ultra Low Voltage......................................................................25  
Deep Sleep VCC and ICC Loadline for Celeron M Processors:  
3
4
5
6
Standard Voltage and Ultra Low Voltage......................................................................26  
Micro-FCPGA Package Top and Bottom Isometric Views .................................................29  
Micro-FCPGA Package - Top and Side Views .................................................................30  
Micro-FCPGA Package - Bottom View...........................................................................31  
7
8
9
10 Micro-FCBGA Package Top and Bottom Isometric Views .................................................33  
11 Micro-FCBGA Package Top and Side Views ...................................................................34  
12 Micro-FCBGA Package Bottom View.............................................................................36  
13 The Coordinates of the Processor Pins As Viewed from the Top of the Package..................38  
Tables  
1
Voltage Identification Definition..................................................................................16  
2
3
4
5
6
7
8
9
FSB Pin Groups ........................................................................................................18  
Processor DC Absolute Maximum Ratings.....................................................................19  
Voltage and Current Specifications..............................................................................20  
Voltage Tolerances for the Celeron M Processor (Deep Sleep State).................................22  
Voltage Tolerances for the Celeron M Processor ULV (Active State)..................................23  
Voltage Tolerances for the Celeron M Processor ULV (Deep Sleep State) ..........................24  
FSB Differential BCLK Specifications............................................................................26  
AGTL+ Signal Group DC Specifications ........................................................................27  
10 CMOS Signal Group DC Specifications..........................................................................27  
11 Open Drain Signal Group DC Specifications ..................................................................28  
12 Micro-FCPGA Package Dimensions ..............................................................................32  
13 Micro-FCPGA Package Dimensions ..............................................................................35  
14 Pin Listing by Pin Name.............................................................................................39  
15 Pin Listing by Pin Number..........................................................................................46  
16 Signal Description.....................................................................................................55  
17 Power Specifications for the Celeron M Processor..........................................................64  
18 Thermal Diode Interface............................................................................................66  
19 Thermal Diode Specification.......................................................................................66  
4
Datasheet  
 复制成功!