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370 参数 Datasheet PDF下载

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型号: 370
PDF下载: 下载PDF文件 查看货源
内容描述: 90纳米制程的赛扬M处理器 [Celeron M Processor on 90 nm Process]
分类和应用:
文件页数/大小: 68 页 / 864 K
品牌: INTEL [ INTEL ]
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Contents  
1
Introduction..............................................................................................................7  
1.1  
1.2  
Terminology .......................................................................................................8  
References .........................................................................................................8  
2
Low Power Features................................................................................................ 11  
2.1  
Clock Control and Low Power States .................................................................... 11  
2.1.1 Normal State......................................................................................... 11  
2.1.2 AutoHALT Power-Down State ................................................................... 11  
2.1.3 Stop-Grant State.................................................................................... 11  
2.1.4 HALT/Grant Snoop State ......................................................................... 12  
2.1.5 Sleep State ........................................................................................... 12  
2.1.6 Deep Sleep State ................................................................................... 13  
FSB Low Power Enhancements............................................................................ 13  
Processor Power Status Indicator (PSI#) Signal..................................................... 14  
2.2  
2.3  
3
Electrical Specifications........................................................................................... 15  
3.1  
Power and Ground Pins ...................................................................................... 15  
3.1.1 FSB Clock (BCLK[1:0]) and Processor Clocking........................................... 15  
Voltage Identification and Power Sequencing ........................................................ 15  
Catastrophic Thermal Protection.......................................................................... 17  
Signal Terminations and Unused Pins................................................................... 17  
FSB Frequency Select Signals (BSEL[1:0])............................................................ 17  
FSB Signal Groups............................................................................................. 17  
CMOS Signals ................................................................................................... 19  
Maximum Ratings.............................................................................................. 19  
Processor DC Specifications ................................................................................ 19  
3.2  
3.3  
3.4  
3.5  
3.6  
3.7  
3.8  
3.9  
4
5
Package Mechanical Specifications and Pin Information.......................................... 29  
4.1  
4.2  
Processor Pinout and Pin List .............................................................................. 37  
Alphabetical Signals Reference............................................................................ 55  
Thermal Specifications and Design Considerations .................................................. 63  
5.1  
Thermal Specifications ....................................................................................... 65  
5.1.1 Thermal Diode ....................................................................................... 65  
5.1.2 Thermal Diode Offset.............................................................................. 66  
5.1.3 Intel® Thermal Monitor........................................................................... 67  
Datasheet  
3
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