Processor Package Mechanical Specifications
3 Processor Package Mechanical
Specifications
3.1
Package Mechanical Specifications
The processor is packaged in a Flip-Chip Land Grid Array (FC-LGA8) package that
interfaces with the motherboard via an LGA1567 socket. The package consists of a
processor mounted on a substrate land-carrier. An integrated heat spreader (IHS) is
attached to the package substrate and core and serves as the mating surface for
processor component thermal solutions, such as a heatsink. Figure 3-1 shows a sketch
of the processor package components and how they are assembled together.
Note:
Processor package mechanical information and drawings provided in this section are
preliminary and subject to change.
The package components shown in Figure 3-1 include the following:
1. Integrated Heat Spreader (IHS)
2. Processor core (die)
3. Package substrate
4. Capacitors
Figure 3-1. Processor Package Assembly Sketch
Die
IHS
Substrate
Capacitors
Socket
System Board
Note:
1.
Socket and motherboard are included for reference and are not part of processor package.
Datasheet Volume 1 of 2
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INTEL [ INTEL ]
