Processor Package Mechanical Specifications
3.1.2
3.1.3
Processor Component Keep-Out Zones
The processor may contain components on the substrate that define component
keep-out zone requirements. A thermal and mechanical solution design must not
intrude into the required keep-out zones. Decoupling capacitors are typically mounted
to either the topside or land-side of the package substrate. See Figure 3-2 and
Figure 3-3 for keep-out zones. The location and quantity of package capacitors may
change due to manufacturing efficiencies but will remain within the component keep-in.
Package Loading Specifications
Table 3-1 provides dynamic and static load specifications for the processor package.
These mechanical maximum load limits should not be exceeded during heatsink
assembly, shipping conditions, or standard use condition. Also, any mechanical system
or component testing should not exceed the maximum limits. The processor package
substrate should not be used as a mechanical reference or load-bearing surface for
thermal and mechanical solution. The minimum loading specification must be
maintained by any thermal and mechanical solutions.
.
Table 3-1.
Processor Loading Specifications
Parameter
Maximum
Notes
755 N
Allowable load on the package IHS
See notes 1, 2, 3
Static Compressive Load
Dynamic Compressive Load
Transient Bend Load
490 N
778 N
See notes 1, 3, 4
See note 4
Notes:
1.
2.
These specifications apply to uniform compressive loading in a direction normal to the processor IHS.
This is the maximum static force that can be applied by the heatsink and retention solution to maintain the
heatsink and processor interface.
3.
4.
These specifications are based on limited testing for design characterization. Loading limits are for the
package only and do not include the limits of the processor socket.
Dynamic loading is defined as an 11-ms duration average load superimposed on the static load
requirement.
3.1.4
Package Handling Guidelines
Table 3-2 includes a list of guidelines on package handling in terms of recommended
maximum loading on the processor IHS relative to a fixed substrate. These package
handling loads may be experienced during heatsink removal.
Table 3-2.
Package Handling Guidelines
Parameter
Maximum
Notes
Shear
Tensile
Torque
355 N
155 N
7.9 N-m
3.1.5
Package Insertion Specifications
The processor can be inserted into and removed from an LGA1567 socket 15 times.
Datasheet Volume 1 of 2
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INTEL [ INTEL ]
