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320 参数 Datasheet PDF下载

320图片预览
型号: 320
PDF下载: 下载PDF文件 查看货源
内容描述: 赛扬D处理器 [Celeron D Processor]
分类和应用:
文件页数/大小: 82 页 / 1743 K
品牌: INTEL [ INTEL ]
 浏览型号320的Datasheet PDF文件第71页浏览型号320的Datasheet PDF文件第72页浏览型号320的Datasheet PDF文件第73页浏览型号320的Datasheet PDF文件第74页浏览型号320的Datasheet PDF文件第76页浏览型号320的Datasheet PDF文件第77页浏览型号320的Datasheet PDF文件第78页浏览型号320的Datasheet PDF文件第79页  
Boxed Processor Specifications  
7.1.2  
Boxed Processor Fan Heatsink Weight  
The boxed processor fan heatsink will not weigh more than 450 grams. See Chapter 5 and the  
Intel® Pentium 4 Processor on 90 nm Process Thermal Design Guidelines for details on the  
processor weight and heatsink requirements.  
Note: The processor retention mechanism based on the Intel reference design should be used, to ensure  
compatibility with the heatsink attach clip assembly and the boxed processor thermal solution. The  
heatsink attach clip assembly is latched to the retention tab features at each corner of the retention  
mechanism.  
The target load applied by the clips to the processor heat spreader for Intel's reference design is  
75 ±15 lbf (maximum load is constrained by the package load capability). It is normal to observe a  
bow or bend in the board due to this compressive load on the processor package and the socket.  
The level of bow or bend depends on the motherboard material properties and component layout.  
Any additional board stiffening devices (such as plates) are not necessary and should not be used  
along with the reference mechanical components and boxed processor. Using such devices  
increases the compressive load on the processor package and socket, likely beyond the maximum  
load that is specified for those components. See the Intel® Pentium 4 Processor on 90 nm Process  
Thermal Design Guidelines for details on the Intel reference design.  
Chassis that have adequate clearance between the motherboard and chassis wall (minimum  
0.250 inch) should be selected to ensure the board's underside bend does not contact the chassis.  
7.1.3  
Boxed Processor Retention Mechanism and Heatsink  
Attach Clip Assembly  
The boxed processor thermal solution requires a processor retention mechanism and a heatsink  
attach clip assembly, to secure the processor and fan heatsink in the baseboard socket. The boxed  
processor will not ship with retention mechanisms but will ship with the heatsink attach clip  
assembly. Baseboards designed for use by system integrators should include the retention  
mechanism that supports the boxed Celeron D processor. Baseboard documentation should include  
appropriate retention mechanism installation instructions.  
Datasheet  
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