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320 参数 Datasheet PDF下载

320图片预览
型号: 320
PDF下载: 下载PDF文件 查看货源
内容描述: 赛扬D处理器 [Celeron D Processor]
分类和应用:
文件页数/大小: 82 页 / 1743 K
品牌: INTEL [ INTEL ]
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Thermal Specifications and Design Considerations  
increments. On-Demand mode may be used in conjunction with the Thermal Monitor. If the system  
tries to enable On-Demand mode at the same time the TCC is engaged, the factory configured duty  
cycle of the TCC will override the duty cycle selected by the On-Demand mode.  
5.2.3  
PROCHOT# Signal Pin  
An external signal, PROCHOT# (processor hot), is asserted when the processor die temperature  
has reached its maximum operating temperature. If the Thermal Monitor is enabled (note that the  
Thermal Monitor must be enabled for the processor to be operating within specification), the TCC  
will be active when PROCHOT# is asserted. The processor can be configured to generate an  
interrupt upon the assertion or de-assertion of PROCHOT#. Refer to the Intel Architecture  
Software Developer's Manuals for specific register and programming details.  
The Celeron D processor implements a bi-directional PROCHOT# capability to allow system  
designs to protect various components from over-temperature situations. The PROCHOT# signal is  
bi-directional in that it can either signal when the processor has reached its maximum operating  
temperature or be driven from an external source to activate the TCC. The ability to activate the  
TCC via PROCHOT# can provide a means for thermal protection of system components.  
One application is the thermal protection of voltage regulators (VR). System designers can create a  
circuit to monitor the VR temperature and activate the TCC when the temperature limit of the VR  
is reached. By asserting PROCHOT# (pulled-low) and activating the TCC, the VR can cool down  
as a result of reduced processor power consumption. Bi-directional PROCHOT# can allow VR  
thermal designs to target maximum sustained current instead of maximum current. Systems should  
still provide proper cooling for the VR, and rely on bi-directional PROCHOT# only as a backup in  
case of system cooling failure. The system thermal design should allow the power delivery  
circuitry to operate within its temperature specification even while the processor is operating at its  
Thermal Design Power. With a properly designed and characterized thermal solution, it is  
anticipated that bi-directional PROCHOT# would only be asserted for very short periods of time  
when running the most power intensive applications. An under-designed thermal solution that is  
not able to prevent excessive assertion of PROCHOT# in the anticipated ambient environment may  
cause a noticeable performance loss. Refer to the applicable chipset platform design guide and the  
applicable VRD design guide for details on implementing the bi-directional PROCHOT# feature.  
5.2.4  
THERMTRIP# Signal Pin  
Regardless of whether or not the Thermal Monitor feature is enabled, in the event of a catastrophic  
cooling failure, the processor will automatically shut down when the silicon has reached an  
elevated temperature (refer to the THERMTRIP# definition in Table 4-3). At this point, the FSB  
signal THERMTRIP# will go active and stay active as described in Table 4-3. THERMTRIP#  
activation is independent of processor activity and does not generate any bus cycles.  
66  
Datasheet