Thermal Specifications and Design Considerations
5 Thermal Specifications and
Design Considerations
5.1
Processor Thermal Specifications
The Celeron D processor requires a thermal solution to maintain temperatures within operating
limits as set forth in Section 5.1.1. Any attempt to operate the processor outside these operating
limits may result in permanent damage to the processor and potentially other components within
the system. As processor technology changes, thermal management becomes increasingly crucial
when building computer systems. Maintaining the proper thermal environment is key to reliable,
long-term system operation.
A complete thermal solution includes both component and system level thermal management
features. Component level thermal solutions can include active or passive heatsinks attached to the
processor Integrated Heat Spreader (IHS). Typical system level thermal solutions may consist of
system fans combined with ducting and venting.
For more information on designing a component level thermal solution, refer to the applicable
thermal design guide.
Note: The boxed processor will ship with a component thermal solution. Refer to Chapter 7 for details on
the boxed processor.
5.1.1
Thermal Specifications
To allow for the optimal operation and long-term reliability of Intel processor-based systems, the
system/processor thermal solution should be designed such that the processor remains within the
minimum and maximum case temperature (TC) specifications when operating at or below the
Thermal Design Power (TDP) value listed per frequency in Table 5-1. Thermal solutions not
designed to provide this level of thermal capability may affect the long-term reliability of the
processor and system. For more details on thermal solution design, refer to the appropriate
processor thermal design guidelines.
The Celeron D processor introduces a new methodology for managing processor temperatures
through fan speed control. Selection of the appropriate fan speed will be based on the temperature
reported by the processor’s Thermal Diode. The fan must be turned on to full speed when TDIODE
is at or above TCONTROL and TC must be maintained at or below TC (max) as defined by the
processor thermal specifications in Table 5-1. The fan speed may be lowered when the processor
temperature can be maintained below TCONTROL as measured by the thermal diode. Systems
implementing fan speed control must be designed to read temperature values from the diode and
T
CONTROL register and take appropriate action. Systems that do not alter the fan speed (always at
full speed) only need to guarantee the case temperature meets specifications in Table 5-1.
The case temperature is defined at the geometric top center of the processor IHS. Analysis
indicates that real applications are unlikely to cause the processor to consume maximum power
dissipation for sustained periods of time. Intel recommends that complete thermal solution designs
target the Thermal Design Power (TDP) indicated in Table 5-1 instead of the maximum processor
Datasheet
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