Thermal Specifications and Design Considerations
power consumption. The Thermal Monitor feature is intended to help protect the processor in the
unlikely event that an application exceeds the TDP recommendation for a sustained period of time.
For more details on the usage of this feature, refer to Section 5.2. In all cases, the Thermal
Monitor feature must be enabled for the processor to remain within specification.
Table 5-1. Processor Thermal Specifications
Core
Frequency
(GHz)
Processor
Number
ThermalDesign Minimum T
Maximum T
(°C)
1,2
C
C
Notes
Power (W)
(°C)
350
345
3.20
3.06
2.93
2.80
2.66
2.53
2.40
73
73
73
73
73
73
73
5
5
5
5
5
5
5
67
67
67
67
67
67
67
—
—
—
—
—
—
—
340
335
330
325
320
NOTES:
1. Thermal Design Power (TDP) should be used for processor thermal solution design targets. The
TDP is not the maximum power that the processor can dissipate.
2. This table shows the maximum TDP for a given frequency range. Individual processors may
have a lower TDP.
5.1.2
Thermal Metrology
The maximum and minimum case temperatures (TC) are specified in Table 5-1. These temperature
specifications are meant to help ensure proper operation of the processor. Figure 5-1 illustrates
where Intel recommends TC thermal measurements should be made. For detailed guidelines on
temperature measurement methodology, refer to the applicable thermal design guide.
Figure 5-1. Case Temperature (TC) Measurement Location
Measure from edge of processor IHS
15.5 mm[0.61 in]
Measure TC at this point
(geometric center of IHS)
15.5 mm[0.61 in]
31 mm x 31 mm IHS[1.22 x 1.22 in]
35 mm x 35 mm substrate [1.378 in x 1.378 in]
64
Datasheet
INTEL [ INTEL ]
