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300 参数 Datasheet PDF下载

300图片预览
型号: 300
PDF下载: 下载PDF文件 查看货源
内容描述: 赛扬D处理器 [Celeron D Processor]
分类和应用:
文件页数/大小: 95 页 / 2070 K
品牌: INTEL [ INTEL ]
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Thermal Specifications and Design Considerations  
5.2.3  
PROCHOT# Signal  
An external signal, PROCHOT# (processor hot), is asserted when the processor die  
temperature has reached its maximum operating temperature. If the Thermal Monitor  
is enabled (note that the Thermal Monitor must be enabled for the processor to be  
operating within specification), the TCC will be active when PROCHOT# is asserted. The  
processor can be configured to generate an interrupt upon the assertion or de-  
assertion of PROCHOT#. Refer to the Intel Architecture Software Developer's Manuals  
for specific register and programming details.  
The Celeron D processor implements a bi-directional PROCHOT# capability to allow  
system designs to protect various components from over-temperature situations. The  
PROCHOT# signal is bi-directional in that it can either signal when the processor has  
reached its maximum operating temperature or be driven from an external source to  
activate the TCC. The ability to activate the TCC via PROCHOT# can provide a means  
for thermal protection of system components.  
One application is the thermal protection of voltage regulators (VR). System designers  
can create a circuit to monitor the VR temperature and activate the TCC when the  
temperature limit of the VR is reached. By asserting PROCHOT# (pulled-low) and  
activating the TCC, the VR can cool down as a result of reduced processor power  
consumption. Bi-directional PROCHOT# can allow VR thermal designs to target  
maximum sustained current instead of maximum current. Systems should still provide  
proper cooling for the VR, and rely on bi-directional PROCHOT# only as a backup in  
case of system cooling failure. Refer to the Voltage Regulator-Down (VRD) 10.1 Design  
Guide For Desktop and Transportable LGA775 Socket for details on implementing the  
bi-directional PROCHOT# feature.  
5.2.4  
5.2.5  
THERMTRIP# Signal  
Regardless of whether or not Thermal Monitor is enabled, in the event of a catastrophic  
cooling failure, the processor will automatically shut down when the silicon has reached  
an elevated temperature (refer to the THERMTRIP# definition in Table 25). At this  
point, the FSB signal THERMTRIP# will go active and stay active as described in  
Table 25. THERMTRIP# activation is independent of processor activity and does not  
generate any bus cycles.  
T
and Fan Speed Reduction  
CONTROL  
TCONTROL is a temperature specification based on a temperature reading from the  
thermal diode. The value for TCONTROL will be calibrated in manufacturing and  
configured for each processor. When TDIODE is above TCONTROL then TC must be at or  
below TC_MAX as defined by the thermal profile in Table 28; otherwise, the processor  
temperature can be maintained at TCONTROL (or lower) as measured by the thermal  
diode.  
The purpose of this feature is to support acoustic optimization through fan speed  
control. Contact your field representative for further details.  
5.2.6  
Thermal Diode  
The processor incorporates an on-die PNP transistor whose base emitter junction is  
used as a thermal "diode", with its collector shorted to Ground. A thermal sensor  
located on the system board may monitor the die temperature of the processor for  
thermal management and fan speed control. Table 30, Table 31, Table 32, and Table 33  
provide the "diode" parameter and interface specifications. Two different sets of "diode"  
parameters are listed in Table 30 and 31. The Diode Model parameters (Table 30) apply  
to traditional thermal sensors that use the Diode Equation to determine the processor  
Datasheet  
81  
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