Package Mechanical Specifications
3.1
Package Mechanical Drawing
The package mechanical drawings are shown in Figure 3-2 and Figure 3-3. The
drawings include dimensions necessary to design a thermal solution for the processor.
These dimensions include:
• Package reference with tolerances (total height, length, width, etc.)
• IHS parallelism and tilt
• Land dimensions
• Top-side and back-side component keep-out dimensions
• Reference datums
• All drawing dimensions are in mm [in].
• Guidelines on potential IHS flatness variation with socket load plate actuation and
installation of the cooling solution is available in the processor Thermal/Mechanical
Design Guidelines.
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Dual-Core Intel® Xeon® Processor 3000 Series Datasheet
INTEL [ INTEL ]
