Package Mechanical Specifications
3 Package Mechanical
Specifications
The processor is packaged in a Flip-Chip Land Grid Array (FC-LGA6) package that
interfaces with the motherboard via an LGA775 socket. The package consists of a
processor core mounted on a substrate land-carrier. An integrated heat spreader (IHS)
is attached to the package substrate and core and serves as the mating surface for
processor component thermal solutions, such as a heatsink. Figure 3-1 shows a sketch
of the processor package components and how they are assembled together. Refer to
the LGA775 Socket Mechanical Design Guide for complete details on the LGA775
socket.
The package components shown in Figure 3-1 include the following:
• Integrated Heat Spreader (IHS)
• Thermal Interface Material (TIM)
• Processor core (die)
• Package substrate
• Capacitors
Figure 3-1. Processor Package Assembly Sketch
Core (die)
TIM
IHS
Substrate
Capacitors
LGA775 Socket
System Board
Note:
1. Socket and System Board are included for reference and are not part of processor package.
Dual-Core Intel® Xeon® Processor 3000 Series Datasheet
35
INTEL [ INTEL ]
