Thermal Specifications and Design Considerations
Thermal Specifications and Design
Considerations
5
The Pentium 4 processor on 0.13 micron process uses an Integrated Heat Spreader (IHS) for
heatsink attachment that is intended to provide for multiple types of thermal solutions. This chapter
provides data necessary for development of a thermal solution. See Figure 5-1 for an enlarged view
of an example of the Pentium 4 processor on 0.13 micron process thermal solution. This is for
illustration purposes only. For further thermal solution design details, refer to the. Intel® Pentium®
4 Processor with 512-KB L2 Cache on 0.13 Micron Process Thermal Design Guidelines.
Note: The processor is shipped either by itself or with a heatsink for boxed processors. See Chapter 7 for
details on boxed processors.
Figure 5-1. Example Thermal Solution (Not to Scale)
Clip Assembly
Fan/Shroud
Heatsink
Retention Mechanism
Processor
mPGA478B
478-pin Socket
Intel® Pentium® 4 Processor on 0.13 Micron Process Datasheet
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INTEL [ INTEL ]
