Ultra-Low Voltage Intel® Celeron® Processor — 650 MHz and 400 MHz
6.0
V Thermal Specifications
CC
In order to achieve proper cooling of the processor, a thermal solution (e.g., heat spreader, heat
pipe, or other heat transfer system) must make firm contact to the exposed processor die. The
processor die must be clean before the thermal solution is attached or the processor may be
damaged.
Table 41 provides the Thermal Design Power (TDP) dissipation and the minimum and maximum
TJ temperatures for the ULV Intel® Celeron® processor. The thermal solution should be designed
to ensure the junction temperature never exceeds the specified value while operating at the
Thermal Design Power. Additionally, a secondary fail-safe mechanism in hardware should be
provided to shutdown the processor at 101° C to prevent permanent damage, as described in
Section 3.1.3. TDP is a thermal design power specification based on the worst case power
dissipation of the processor while executing publicly available software under normal operating
conditions at nominal voltages. Contact your Intel Field Sales Representative for further
information.
Table 41. Power Specifications for the Ultra-Low Voltage Intel® Celeron® Processor
Thermal
Thermal
Symbol
Core Frequency/Voltage
Design Power Design Power Unit
Notes
(typ)
(max)
650 MHz and 1.10 V
400 MHz and 0.95 V
7.00
3.40
8.30
4.23
TDP
W
At 100° C, 1, 4
Symbol
Parameter
Min
Max
Unit
Notes
Auto Halt power at
1.10 V
0.95 V
1.9
1.0
PAH
W
W
At 50° C, 2
At 50° C, 2
Quick Start power at
1.10 V
0.95 V
1.7
0.9
PQS
Deep Sleep power at
1.10 V
0.95 V
1.6
0.7
PDSLP
W
At 35° C, 2
3
TJ
Junction Temperature
0
100
° C
NOTES:
1. TDP (typ) is defined as the worst case power dissipated by the processor while executing publicly
available software under normal operating conditions at nominal voltages that meet the load line
specifications. The TDP number shown is a specification based on Icc (maximum) and indirectly tested by
Icc (maximum) testing. The Intel TDP specification is a recommended design point and is not
representative of the absolute maximum power the processor may dissipate under worst case conditions.
2. Not 100% tested. These power specifications are determined by characterization of the processor currents
at higher temperatures and extrapolating the values for the temperature indicated.
3. TJ is measured with the on-die thermal diode.
4. TDP (max) is defined as the worst case power dissipated by the processor while executing a worst case
instruction mix, operating at typical Vcc and under normal operating conditions.
Datasheet
65
INTEL [ INTEL ]
