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253668 参数 Datasheet PDF下载

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型号: 253668
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内容描述: 双核英特尔​​®至强®处理器 [Dual-Core Intel Xeon Processor]
分类和应用:
文件页数/大小: 104 页 / 3687 K
品牌: INTEL [ INTEL ]
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Thermal Specifications  
Figure 6-3. Dual-Core Intel Xeon Processor 5063 (MV) Thermal Profile  
Thermal Profile  
70  
TCASE_MAX@TDP  
65  
Thermal Profile  
Y = 0.260*x + 42.3  
60  
55  
50  
45  
40  
0
10  
20  
30  
40  
50  
60  
70  
80  
90  
100  
Power [W]  
Notes:  
1.  
Thermal Profile is representative of a volumetrically constrained platform. Please refer to Table 6-8 for  
discrete points that constitute the thermal profile.  
2.  
Implementation of Thermal Profile should result in virtually no TCC activation. Furthermore, utilization of  
thermal solutions that do not meet Thermal Profile will not meet the processor’s thermal specifications and  
may result in permanent damage to the processor.  
®
®
3.  
Refer to the Dual-Core Intel Xeon Processor 5000 Series Thermal/Mechanical Design Guidelines for  
system and environment implementation details.  
Table 6-8.  
Dual-Core Intel Xeon Processor 5063 (MV) Thermal Profile Table  
Power (W)  
T
(° C)  
Power (W)  
T
(° C)  
CASE_MAX  
50.0  
CASE_MAX  
61.8  
P_profile_min =29.6  
_B  
75  
80  
85  
90  
95  
35  
40  
45  
50  
55  
60  
65  
70  
51.4  
63.1  
52.7  
64.4  
54.0  
65.7  
55.3  
67.0  
56.6  
57.9  
59.2  
60.5  
6.1.2  
Thermal Metrology  
The minimum and maximum case temperatures (TCASE) specified in Table 6-2,  
Table 6-3, Table 6-5, and Table 6-6 are measured at the geometric top center of the  
processor integrated heat spreader (IHS). Figure 6-4 illustrates the location where  
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet  
75  
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