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253668 参数 Datasheet PDF下载

253668图片预览
型号: 253668
PDF下载: 下载PDF文件 查看货源
内容描述: 双核英特尔​​®至强®处理器 [Dual-Core Intel Xeon Processor]
分类和应用:
文件页数/大小: 104 页 / 3687 K
品牌: INTEL [ INTEL ]
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Debug Tools Specifications  
9.3.1  
Mechanical Considerations  
The LAI is installed between the processor socket and the processor. The LAI plugs into  
the socket, while the processor plugs into a socket on the LAI. Cabling that is part of  
the LAI egresses the system to allow an electrical connection between the processor  
and a logic analyzer. The maximum volume occupied by the LAI, known as the keepout  
volume, as well as the cable egress restrictions, should be obtained from the logic  
analyzer vendor. System designers must make sure that the keepout volume remains  
unobstructed inside the system. Note that it is possible that the keepout volume  
reserved for the LAI may include differerent requirements from the space normally  
occupied by the heatsink. If this is the case, the logic analyzer vendor will provide a  
cooling solution as part of the LAI.  
9.3.2  
Electrical Considerations  
The LAI will also affect the electrical performance of the FSB, therefore it is critical to  
obtain electrical load models from each of the logic analyzer vendors to be able to run  
system level simulations to prove that their tool will work in the system. Contact the  
logic analyzer vendor for electrical specifications and load models for the LAI solution  
they provide.  
§
104  
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet  
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