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253668 参数 Datasheet PDF下载

253668图片预览
型号: 253668
PDF下载: 下载PDF文件 查看货源
内容描述: 双核英特尔​​®至强®处理器 [Dual-Core Intel Xeon Processor]
分类和应用:
文件页数/大小: 104 页 / 3687 K
品牌: INTEL [ INTEL ]
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Boxed Processor Specifications  
The fan power header on the baseboard must be positioned to allow the fan heat sink  
power cable to reach it. The fan power header identification and location must be  
documented in the suppliers platform documentation, or on the baseboard itself. The  
baseboard fan power header should be positioned within 177.8 mm [7 in.] from the  
center of the processor socket.  
Table 8-1.  
Table 8-2.  
PWM Fan Frequency Specifications for 4-Pin Active CEK Thermal Solution  
Description  
Min Frequency  
Nominal Frequency  
Max Frequency  
Unit  
PWM Control  
21,000  
25,000  
28,000  
Hz  
Frequency Range  
Fan Specifications for 4-pin Active CEK Thermal Solution  
Typ  
Steady  
Max  
Steady  
Max  
Startup  
Description  
Min  
Unit  
+12 V: 12 volt fan power supply  
IC: Fan Current Draw  
10.8  
N/A  
2
12  
1
12  
1.25  
2
13.2  
1.5  
2
V
A
SENSE: SENSE frequency  
2
Pulses per fan  
revolution  
Figure 8-11. Fan Cable Connector Pin Out for 4-Pin Active CEK Thermal Solution  
Table 8-3.  
Fan Cable Connector Pin Out for 4-Pin Active CEK Thermal Solution  
Pin Number  
Signal  
Color  
1
2
3
4
Ground  
Black  
Yellow  
Green  
Blue  
Power: (+12 V)  
Sense: 2 pulses per revolution  
Control: 21 KHz-28 KHz  
8.3.2  
Boxed Processor Cooling Requirements  
As previously stated the boxed processor will be available in two product  
configurations. Each configuration will require unique design considerations. Meeting  
the processor’s temperature specifications is also the function of the thermal design of  
the entire system, and ultimately the responsibility of the system integrator. The  
processor temperature specifications are found in Chapter 6, “Thermal Specifications”  
of this document.  
100  
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet  
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