Contents
1.
Introduction.........................................................................................................................9
1.1
1.2
Terminology.........................................................................................................11
References..........................................................................................................11
2.
Electrical Specifications....................................................................................................13
2.1
2.2
2.3
System Bus and GTLREF...................................................................................13
Power and Ground Pins ......................................................................................13
Decoupling Guidelines ........................................................................................13
2.3.1 VCC Decoupling.....................................................................................14
2.3.2 System Bus AGTL+ Decoupling.............................................................14
2.3.3 System Bus Clock (BCLK[1:0]) and Processor Clocking .......................14
Voltage Identification and Power Sequencing.....................................................15
2.4.1 Enhanced Intel® SpeedStep® Technology............................................16
2.4.2 Phase Lock Loop (PLL) Power and Filter...............................................17
2.4.3 Catastrophic Thermal Protection............................................................18
Signal Terminations, Unused Pins and TESTHI[10:0] ........................................18
System Bus Signal Groups .................................................................................20
Asynchronous GTL+ Signals...............................................................................22
Test Access Port (TAP) Connection....................................................................22
System Bus Frequency Select Signals (BSEL[1:0])............................................22
Maximum Ratings................................................................................................23
Processor DC Specifications...............................................................................23
AGTL+ System Bus Specifications .....................................................................34
System Bus AC Specifications............................................................................35
Processor AC Timing Waveforms .......................................................................40
2.4
2.5
2.6
2.7
2.8
2.9
2.10
2.11
2.12
2.13
2.14
3.
System Bus Signal Quality Specifications........................................................................51
3.1
System Bus Clock (BCLK) Signal Quality Specifications and Measurement
Guidelines ...........................................................................................................51
System Bus Signal Quality Specifications and Measurement Guidelines...........52
System Bus Signal Quality Specifications and Measurement Guidelines...........55
3.3.1 Overshoot/Undershoot Guidelines .........................................................55
3.3.2 Overshoot/Undershoot Magnitude .........................................................55
3.3.3 Overshoot/Undershoot Pulse Duration...................................................55
3.3.4 Activity Factor.........................................................................................56
3.3.5 Reading Overshoot/Undershoot Specification Tables............................56
3.3.6 Conformance Determination to Overshoot/Undershoot Specifications..57
3.2
3.3
4.
5.
Package Mechanical Specifications.................................................................................61
4.1 Processor Pin-Out...............................................................................................64
Pin Listing and Signal Definitions.....................................................................................67
5.1
5.2
Mobile Intel Pentium 4 Processor-M Pin Assignments........................................67
Alphabetical Signals Reference ..........................................................................81
6.
Thermal Specifications and Design Considerations.........................................................89
6.1 Thermal Specifications........................................................................................90
Mobile Intel Pentium 4 Processor-M Datasheet
3
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