XC835/836
Package and Quality Declaration
4
Package and Quality Declaration
Chapter 4 provides the information of the XC835/836 package and reliability section.
4.1
Package Parameters
Table 24 provides the thermal characteristics of the packages used in XC835 and
XC836 respectively.
Table 24
Parameter
Thermal Characteristics of the Packages
Symbol Limit Values
Unit Package Types
Min.
Max.
30.8
27.0
20.2
30.5
195.3
41
Thermalresistancejunction RTJC CC -
K/W PG-DSO-24-1
case1)
-
-
K/W PG-TSSOP-28-1
K/W PG-TSSOP-28-12
K/W PG-DSO-24-1
K/W PG-TSSOP-28-1
K/W PG-TSSOP-28-12
Thermalresistancejunction RTJL CC -
lead1)
-
-
1) The thermal resistances between the case and the ambient (RTCA) , the lead and the ambient (RTLA) are to be
combined with the thermal resistances between the junction and the case (RTJC), the junction and the lead
(RTJL) given above, in order to calculate the total thermal resistance between the junction and the ambient
(RTJA). The thermal resistances between the case and the ambient (RTCA), the lead and the ambient (RTLA
)
depend on the external system (PCB, case) characteristics, and are under user responsibility.
The junction temperature can be calculated using the following equation: TJ=TA+RTJA × PD, where the RTJA is
the total thermal resistance between the junction and the ambient. This total junction ambient resistance RTJA
can be obtained from the upper four partial thermal resistances, by
a) simply adding only the two thermal resistances (junction lead and lead ambient), or
b) by taking all four resistances into account, depending on the precision needed.
Data Sheet
46
V1.2, 2011-03
INFINEON [ Infineon ]
