XC2287 / XC2286 / XC2285
XC2000 Family Derivatives
Preliminary
Package and Reliability
5
Package and Reliability
In addition to the electrical parameters, the following information ensures proper
integration of the XC228x into the target system.
5.1
Packaging
These parameters describe the housing rather than the silicon.
Table 26
Package Parameters (PG-LQFP-144)
Symbol Limit Values
Min. Max.
Exposed Pad Dimension Ex × Ey – 6.5 × 6.5 mm
Parameter
Unit
Notes
–
Power Dissipation
PDISS
RΘJA
–
–
1.0
45
36
22
W
–
Thermal resistance
Junction-Ambient
K/W
K/W
K/W
No thermal via1)
4-layer, no pad2)
4-layer, pad3)
1) Device mounted on a 2-layer or 4-layer board without thermal vias.
2) Device mounted on a 4-layer board with thermal vias, exposed pad not soldered.
3) Device mounted on a 4-layer board with thermal vias, exposed pad soldered to the board.
Data Sheet
104
V0.91, 2007-02
Draft Version
INFINEON [ Infineon ]
