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    SAK-TC399XP-256F300S BC 参数 Datasheet PDF下载

    SAK-TC399XP-256F300S BC图片预览
    型号： SAK-TC399XP-256F300S BC
    PDF下载： 下载PDF文件 查看货源
    内容描述： [Infineon releases its second generation AURIX microcontroller in embedded flash 40 nm technology. It comes back with an increase in performance, memory sizes, connectivity and more scalability to address the new automotive trends and challenges. This family has more than 20 products to provide the most scalable portfolio of safety microcontrol­ler. In terms of performance, the highest end product TC39x offers 6 cores running at 300 MHz and up to 6.9 MBytes embedded RAM, and consuming below 2 W. ]
    分类和应用：
    文件页数/大小： 548 页 / 21256 K
    品牌： INFINEON [ Infineon ]
     浏览型号SAK-TC399XP-256F300S BC的Datasheet PDF文件第514页浏览型号SAK-TC399XP-256F300S BC的Datasheet PDF文件第515页浏览型号SAK-TC399XP-256F300S BC的Datasheet PDF文件第516页浏览型号SAK-TC399XP-256F300S BC的Datasheet PDF文件第517页浏览型号SAK-TC399XP-256F300S BC的Datasheet PDF文件第519页浏览型号SAK-TC399XP-256F300S BC的Datasheet PDF文件第520页浏览型号SAK-TC399XP-256F300S BC的Datasheet PDF文件第521页浏览型号SAK-TC399XP-256F300S BC的Datasheet PDF文件第522页  
    TC39x BC/BD-Step  
    Electrical SpecificationPackage Outline  
    3.34.1  
    Package Parameters  
    Table 3-79 Package Parameters  
    Parameter  
    Symbol  
    Values  
    Typ.  
    Unit  
    Note / Test Condition  
    Min.  
    Max.  
    14  
    12.2  
    4
    Thermal resistance (junction to RTH_JA  
    ambient) 1)  
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    K/W  
    K/W  
    K/W  
    K/W  
    K/W  
    K/W  
    LFBGA292  
    LFBGA516  
    LFBGA292  
    LFBGA516  
    LFBGA292  
    LFBGA516  
    CC  
    Thermal resistance (junction to RTH_JCB  
    case bottom) 1)  
    CC  
    3
    Thermal resistance (junction to RTH_JCT  
    case top) 1)  
    CC  
    5
    5
    1) The top and bottom thermal resistances between the case and the ambient (RTH_CTA, RTH_CBA) are to be combined with  
    the thermal resistances between the junction and the case given above (RTH_JCT, RTH_JCB), in order to calculate the total  
    thermal resistance between the junction and the ambient (RTH_JA). The thermal resistances between the case and the  
    ambient (RTH_CTA, RTH_CBA) depend on the external system (PCB, case) characteristics and are under user responsibility.  
    The junction temperature can be calculated using the following equation: TJ = TA + RTH_JA * PD, where the RTH_JA is the  
    total thermal resistance between the junction and the ambient.  
    Thermal resistances as measured by the 'cold plate method' (MIL SPEC-883 Method 1012.1).  
    Data Sheet  
    518  
    V 1.2, 2021-03  
    OPEN MARKET VERSION  

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