BTS7040-1EPA
PROFET™ +2 12V
General Product Characteristics
4.4.1
PCB Setup
70 µm modeled (traces, cooling area)
70 µm, 5% metalization*
*: means percentual Cu metalization on each layer
PCB_Zth_1s0p.emf
Figure 5
1s0p PCB Cross Section
70 µm modeled (traces)
35 µm, 90% metalization*
35 µm, 90% metalization*
70 µm, 5% metalization*
*: means percentual Cu metalization on each layer
PCB_Zth_2s2p.emf
Figure 6
2s2p PCB Cross Section
PCB 1s0p + 600 mm2 cooling
PCB 2s2p / 1s0p footprint
PCB_sim_setup_TSDSO14.emf
Figure 7
PCB setup for thermal simulations
PCB_ 2s2p_vias_TSDSO14.emf
Figure 8
Thermal vias on PCB for 2s2p PCB setup
Data Sheet
11
Rev. 1.10
2020-12-14
INFINEON [ Infineon ]
