BSS 123
Maximum Ratings
Parameter
Symbol
Values
Unit
Chip or operating temperature
Storage temperature
Thermal resistance, chip to ambient air
1)
Therminal resistance, chip-substrate- reverse side
1)
DIN humidity category, DIN 40 040
IEC climatic category, DIN IEC 68-1
T
j
T
stg
R
thJA
R
thJSR
-55 ... + 150
-55 ... + 150
˚C
≤
350
≤
285
E
55 / 150 / 56
K/W
1) For package mounted on aluminium
15 mm x 16.7 mm x 0.7 mm
Electrical Characteristics,
at
T
j
= 25˚C, unless otherwise specified
Parameter
Symbol
min.
Values
typ.
max.
Unit
Static Characteristics
Drain- source breakdown voltage
V
GS
= 0 V,
I
D
= 0.25 mA,
T
j
= 25 ˚C
V
(BR)DSS
V
100
-
-
Gate threshold voltage
V
GS=
V
DS,
I
D
= 1 mA
V
GS(th)
0.8
I
DSS
1.5
2
Zero gate voltage drain current
V
DS
= 100 V,
V
GS
= 0 V,
T
j
= 25 ˚C
V
DS
= 100 V,
V
GS
= 0 V,
T
j
= 125 ˚C
V
DS
= 20 V,
V
GS
= 0 V,
T
j
= 25 ˚C
-
-
-
I
GSS
0.1
2
-
1
60
10
µA
nA
nA
Gate-source leakage current
V
GS
= 20 V,
V
DS
= 0 V
-
R
DS(on)
10
50
Drain-Source on-state resistance
V
GS
= 10 V,
I
D
= 0.17 A
V
GS
= 4.5 V,
I
D
= 0.17 A
Ω
-
-
3
4.5
6
10
2
05.99
INFINEON [ INFINEON TECHNOLOGIES AG ]
