ICS332-33
Dual Output Clock Synthesizer
Package Outline and Package Dimensions
(8 pin SOIC, 150 Mil. Body)
Package dimensions are kept current with JEDEC Publication No. 95
Millimeters
8
Inches
Min
Max
Symbol
Min
Max
A
A1
E
INDEX
AREA
H
1.35
0.10
0.33
0.19
4.80
3.80
5.80
0.25
0.40
0
°
h x 45
1.75
0.25
0.51
0.25
5.00
4.00
6.20
0.50
1.27
8
°
.0532
.0040
.013
.0075
.1890
.1497
.2284
.010
.016
0
°
.0688
.0098
.020
.0098
.1968
.1574
.2440
.020
.050
8
°
B
C
D
E
e
H
1 2
D
1.27 BASIC
0.050 BASIC
h
L
α
A
A1
C
-C-
e
B
SEATING
PLANE
L
.10 (.004)
C
Ordering Information
Part / Order Number
332M-33LF
332M-33LFT
Marking
332M33L
Shipping Packaging
Tubes
Tape and Reel
Package
8-pin SOIC
8-pin SOIC
Temperature
0 to +70
°
C
0 to +70
°
C
*NOTE: EOL for non-green parts to occur on 5/13/10 per PDN U-09-01
“LF” denotes Pb (lead) free package.
While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT)
assumes no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would
result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial
applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary
environmental requirements are not recommended without additional processing by IDT. IDT reserves the right to change any
circuitry or specifications without notice. IDT does not authorize or warrant any IDT product for use in life support devices or
critical medical instruments.
MDS 332-33 D
5
I n t e gra te d D ev i ce Technology, Inc.
●
Revision 051310
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IDT [ INTEGRATED DEVICE TECHNOLOGY ]
