iC-GF
TRANSCEIVER
Rev C1, Page 4/26
PACKAGES QFN24 4 mm x 4 mm to JEDEC Standard
PIN CONFIGURATION QFN24 4 mm x 4 mm
PIN FUNCTIONS
No. Name Function
5 QCFG2 Configuration Input Channel 2
SCLK Serial Clock (SPI mode)
23
22
24
21
20
19
6 IN2
Input Channel 2
18
17
16
15
14
13
1
2
MOSI Master Output Slave Input (SPI mode)
7 OEN
8 NOVL Overload Error Output
Output Enable Input
3
NDIAG Diagnosis Output (SPI mode)
9 NUVD Undervoltage Error Output
MISO Master Input Slave Output (SPI mode)
10 CFO
RX
11 CFP
12 CFI
13 QP2
14 QN2
15 VN
GF
4
5
code...
...
Feedback Channel Output
Transmission Output (SPI mode)
Configuration Input Feedback Channel
Feedback Channel Input
High Side Switch Output Channel 2
Low Side Switch Output Channel 2
Ground
6
8
9
10
12
7
11
PIN FUNCTIONS
No. Name Function
16 QN1
17 QP1
18 VBO
19 VBR
20 VHL
21 VH
Low Side Switch Output Channel 1
High Side Switch Output Channel 1
Power Supply
Power Supply for switching converter
Inductor Switching Converter
Input Linear Regulators
1 ISET
Reference Current for current limitation
of driver outputs
2 INV1
ESPI
3 IN1
TX
Inverting Input Channel 1
Enable SPI (pin open)
Input Channel 1
22 VCC
5 V Sensor Supply
Transmission Input (SPI mode)
23 VCC3 3.3 V Sensor Supply
24 GND Sensor Ground
4 QCFG1 Configuration Input Channel 1
NCS Chip Select (SPI mode)
The Thermal Pad is to be connected to a Ground Plane (VN) on the PCB.
Only pin 1 marking on top or bottom defines the package orientation (iC-GF label and coding is subject
to change).