iC-DI
DUAL SENSOR INTERFACE
Rev C2, Page 3/15
PACKAGES QFN24 4 mm x 4 mm to JEDEC Standard
PIN CONFIGURATION QFN24 4 mm x 4 mm
24
23
22
21
20
19
1
18
2
17
3
16
4
5
DI
code...
...
15
14
6
13
7
8
9
10
11
12
PIN FUNCTIONS
No. Name Function
1 ISET Reference Current for current limitation
of driver outputs
2 INV1 Inverting Input Channel 1
3 IN1
Input Channel 1
PIN FUNCTIONS
No. Name Function
4 QCFG1 Configuration Input Channel 1
5 QCFG2 Configuration Input Channel 2
6 IN2
Input Channel 2
7 OEN
Output Enable Input
8 NOVL Overload Error Output
9 NUVD Undervoltage Error Output
10 CFO
Output Feedback Channel
11 CFP
Configuration Input Feedback Channel
12 CFI
Input Feedback Channel
13 QP2
Output High Side Switch Channel 2
14 QN2
Output Low Side Switch Channel 2
15 VN
Reference Voltage Low Side Switch
16 QN1
Output Low Side Switch Channel 1
17 QP1
Output High Side Switch Channel 1
18 VBO
Reference Voltage High Side Switch
19 VBR
Power Supply switching converter and
linear regulators
20 VHL
Inductor Switching Converter
21 VH
Input Linear Regulators
22 VCC
5 V Sensor Supply
23 VCC3 3.3 V Sensor Supply
24 GND
Ground
Pins GND and VN must not be externally connected, otherwise with reverse bias intolerably high current
may flow!
The
Thermal Pad
is to be connected to a Ground Plane (VN) on the PCB.
Only pin 1 marking on top or bottom defines the package orientation (iC-DI label and coding is subject
to change).