Si4430/31/32-B1
Table 5. Auxiliary Block Specifications1
Parameter
Symbol
Conditions
Min
Typ
Max
Units
Temperature Sensor
Accuracy
TS
After calibrated via sensor offset
register tvoffs[7:0]
—
0.5
—
°C
A
2
Temperature Sensor
Sensitivity
TS
—
—
5
50
250
—
—
—
mV/°C
mV
S
2
Low Battery Detector
LBD
RES
2
Resolution
Low Battery Detector
LBD
—
—
µs
CT
2
Conversion Time
Microcontroller Clock
Output Frequency
F
Configurable to 30 MHz,
15 MHz, 10 MHz, 4 MHz,
3 MHz, 2 MHz, 1 MHz, or
32.768 kHz
32.768K
30M
Hz
MC
General Purpose ADC
Resolution
ADC
ADC
—
—
—
8
4
—
—
—
bit
mV/bit
µs
ENB
RES
2
General Purpose ADC Bit
2
Resolution
Temp Sensor & General
Purpose ADC Conversion
ADC
305
CT
2
Time
30 MHz XTAL Start-Up time
t
Using XTAL and board layout in
reference design. Start-up time
will vary with XTAL type and
board layout.
—
—
600
97
—
—
µs
fF
30M
30 MHz XTAL Cap
30M
See "5.8. Crystal Oscillator" on
page 40 for total load
RES
2
Resolution
capacitance calculation
2
32 kHz XTAL Start-Up Time
t
—
—
6
—
—
sec
32k
32 kHz XTAL Accuracy
32K
Using 20 ppm 32 kHz Crystal
100
ppm
RES
2
using 32 kHz XTAL
32 kHz Accuracy using
Internal RC Oscillator
32KRC
—
2500
—
ppm
RES
2
POR Reset Time
t
—
—
16
—
—
ms
µs
POR
2
Software Reset Time
t
100
soft
Notes:
1. All specification guaranteed by production test unless otherwise noted. Production test conditions and max limits are
listed in the "Production Test Conditions" section on page 14.
2. Guaranteed by qualification. Qualification test conditions are listed in the "Production Test Conditions" section on
page 14.
Rev 1.0
11
IBM [ IBM ]
