Datasheet
DD2.X
Preliminary
PowerPC 750CL Microprocessor
Table 5-5. 750CL Heat-Sink Vendors
Company Names and Addresses for Heat-Sink Vendors
Cool Polymers (formerly Chip Coolers, Inc.)
333 Strawberry Field Rd.
Warwick, RI 02886
(888) 811-3787
http://coolpolymers.com
International Electronic Research Corporation (IERC)
413 North Moss Street
Burbank, CA 91502
(818) 842-7277
http://www.ctscorp.com
Aavid Thermalloy
80 Commercial Street
Concord, NH 03301
(603) 224-9888
http://www.aavid.com
http://www.aavidthermalloy.com
Wakefield Thermal Solutions Inc.
33 Bridge Street
Pellham, NH 03076
(603) 635-2800
http://www.wakefield.com
5.8.1 Minimum Heat Sink Requirements
The worst-case power dissipation (P ) for the 750CL is shown in Table 3-5, Power Consumption, on
D
page 24. A conservative thermal management design will provide sufficient cooling to maintain the junction
temperature (T ) of the 750CL below 105°C at maximum P and worst-case ambient temperature and airflow
J
D
conditions.
Many factors affect the 750CL power dissipation, including V , T , core frequency, process factors, and the
DD
J
code that is running on the processor. In general, P increases with increases in T , V , core frequency,
D
J
DD
process variables, and the number of instructions executed per second.
For various reasons, a designer may determine that the power dissipation of the 750CL in their application
will be less than the maximum value shown in this datasheet. Assuming a lower P will result in a thermal
D
management system with less cooling capacity than would be required for the maximum P shown in the
D
datasheet. In this case, the designer may decide to determine the actual maximum 750CL P in the particular
D
application. Contact your IBM PowerPC field applications engineer for more information.
However, regardless of methodology, IBM only supports system designs that successfully maintain the
maximum junction temperature within the datasheet limits. IBM also supports designs that rely on the
maximum P values given in this datasheet and supply a cooling solution sufficient to dissipate that amount
D
of power while keeping the maximum junction temperature below the maximum T .
J
Version 2.5
System Design Information
Page 57 of 70
December 2, 2008
IBM [ IBM ]
