Datasheet
DD2.X
PowerPC 750CL Microprocessor
Preliminary
5.8 Thermal Management Information
This section provides thermal management information for the FCPBGA package for air cooled applications.
Proper thermal control design is primarily dependent upon the system-level design; that is, the heat sink, air
flow, and the thermal interface material. To reduce the die-junction temperature, heat sinks may be attached
to the package by several methods: adhesive, mounting clip, or a screw assembly.
Figure 5-7. Package Exploded Cross-Sectional
FCPBGA Package
Heat Sink
Adhesive
or
Thermal
Interface
Material
Printed
Circuit
Board
The board designer can choose between several types of heat sinks to place on the 750CL. There are many
commercially-available heat sinks that are appropriate for the 750CL provided by the vendors listed in Table
5-5, 750CL Heat-Sink Vendors, on page 57.
System Design Information
Page 56 of 70
Version 2.5
December 2, 2008
IBM [ IBM ]
