Datasheet
DD2.X
Preliminary
PowerPC 750CL Microprocessor
4. Dimensions and Signal Assignments
IBM offers a flip chip plastic ball grid array (FCPBGA) that supports 278 balls for the 750CL package. This is
a signal and power compatible footprint to the PowerPC 750GX RISC microprocessor module. The 750CL
pinout, power dissipation, timing, and signal definitions are not completely identical to the 750GX. See the
PowerPC 750CL DD1.2 Differences from 750GX Application Note for details.
4.1 Package
4.1.1 Overview
FCPBGA packages are suited for applications requiring much higher I/O counts and better electrical perfor-
mance than that offered by enhanced plastic ball grid array (EPBGA) and high-performance ball grid array
(HPBGA) packages. They are recommended for applications having medium electrical performance and
power dissipation requirements.
4.1.2 Features
• Low dielectric-constant organic build-up substrate
• Flip chip die attach; BGA second-level interconnect
• Two-layer core
• JEDEC-compliant packages
Version 2.5
Dimensions and Signal Assignments
Page 37 of 70
December 2, 2008
IBM [ IBM ]
