Datasheet
DD2.X
PowerPC 750CL Microprocessor
Preliminary
Table 3-2. Recommended Operating Conditions
Characteristic
Core supply voltage
Symbol
VDD
Value
See note 2
1.15±.05
Unit
V
Notes
2
60X bus I/O supply voltage (1.15 V)
60X bus I/O supply voltage (1.8 V)
PLL supply voltage
OVDD
OVDD
AVDD
VIN
V
1.8±5%
V
See note 2
GND to OVDD
0 to 105
V
1, 2
Input voltage
V
Die-junction temperature
Notes:
TJ
°C
1. See Section 5.3, PLL Power Supply Filtering, on page 45 for AVDD noise filtering requirements.
2. The core supply voltage (VDD) and PLL supply voltage (AVDD) are specified by the part number. See Section 1.3, Part Number
Information, on page 12 for the recommended operating VDD range for each part number.
Table 3-3. Package Thermal Characteristics
Characteristic
Symbol
Value
2
Unit
FCPBGA package thermal resistance, junction-to-case thermal resistance (typ-
ical)
θJC
°C/W
FCPBGA package thermal resistance, junction-to-lead thermal resistance (typi-
cal)
θJB
13
°C/W
Note: θJC is the internal resistance from the junction to the top surface of the package. A heatsink is generally required to ensure that
the die junction temperature is maintained within the limits defined in Table 3-2, Recommended Operating Conditions, on page 22.
Note: Thermal resistance values are based on modeling only.
Electrical and Thermal Characteristics
Page 22 of 70
Version 2.5
December 2, 2008
IBM [ IBM ]
