IBM3602022Q020
Datasheet
900 MHz AMPS/TDMA Power Amplifier
Figure 3. QFN Package Dimensions
Top View
4.0 ±0.1
Side View
0.8 - 1.0
Bottom View
2.8 ±0.15
16 17 18 19 20
15
14
4.0 ±0.1
13
12
11
0.25 ±0.025
10
0.4 ±0.05
0.25 ref
0.5
9
8
7
6
1
2
3
4
5
2.8 ±0.15
Notes:
Dimensions are in millimeters. Not to scale. Pin numbers are shown for reference.
Figure 4. PCB Pad Placement, QFN Package
0.42
2.1
20
1
2
2.1
3
4
5
6
7
0.5
8
9
10
0.23
19 18 17
16
0.42
15
14
13
12
11
0.5
Notes:
Dimensions are in millimeters. Not to scale. Shaded area shows PCB pad. Pin numbers are shown for reference.
Page 6 of 7
December 19, 2001