IBM3602022Q020
Datasheet
900 MHz AMPS/TDMA Power Amplifier
Table 6. Lead Description
(QFN, 20-lead, 4mm x 4mm package)
Lead
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
paddle
Name
RF IN
GND
Iset_d
Iset_o
ON/OFF
VCCA
VBB2
OP_FB
GND
GND
GND
RFOUT1/VCCO
RFOUT2/VCCO
RFOUT3/VCCO
GND
GND
GND
VCC_D
VCC_D
GND
GND
Type
RF
--
Power
Power
Input
Power
Power
Power
--
--
--
Output
Output
Output
--
--
--
Power
Power
--
Power
PA input
No connection, may be connected to ground
Resistor connected to ground or to MD_SEL to control driver (first) stage Icc
Resistor connected to ground or to MD_SEL to control output (second) stage Icc
PA on/off; logic low turns PA on
DC supply for bias circuitry
Capacitor to ground for additional bypassing of output (second) stage
Optional output feedback
No connection required, grounding recommended
No connection required, grounding recommended
No connection required grounding recommended
PA output; 1 of 3 / DC supply for final stage (VCCO)
PA output; 2 of 3 / DC supply for final stage (VCCO)
PA output; 3 of 3 / DC supply for final stage (VCCO)
No connection required, grounding recommended
No connection required, grounding recommended
No connection required, grounding recommended
DC supply for driver (first) stage; 1 of 2
DC supply for driver (first) stage; 2 of 2
No connection required, grounding recommended
Exposed paddle; DC and RF ground
Description
Table 7. Pin Out
19
VCC_D
18
VCC_D
20
GND
17
GND
RFIN
1
GND
2
Iset_d
3
Iset_o
4
ON/OFF
5
Bias
and
Logic
Network
16
GND
15
GND
14
RF OUT1
13
RF OUT2
12
RF OUT3
11
GND
VCCA
6
VBB2
7
OP_FB
8
Package Base is GND
Page 4 of 7
GND
10
GND
9
December 19, 2001
IBM [ IBM ]
