Datasheet
IBM PowerPC 750GX RISC Microprocessor
DD1.X
Figure 4-1. Mechanical Dimensions, Standard (Leaded) Package
Module Subassembly Drawing 96P3537
A01 Corner
(Chip Carrier)
45L5857 (292)
This Side
Module SUB-ASM
3
A J4
5
Solderball
Capacitor
C4Encapsulant
Fillet
Chip
1
A
D
2
E
A
B
2
1
(21± 0.2)
0.81 ± 0.1
(1.32 MAX)
(1.08 MIN)
(7X)(0.51 MAX)
(7X)(1.83 MAX)
(7X)(2.74 MAX)
(21)
19
A01 Corner
(Chip carrier)
B
2
(19X) (1)
2
(0.907 MAX)
(0.779 MIN)
(2.227 MAX)
(1.859 MIN)
(3.137 MAX)
(2.569 MIN)
C
0.15
1
Seating
Plane
C
(0.91 MAX)
(0.33 MIN)
(292X) ∅0.8 ± 0.04
1
C7
VIEW A-A
This Side
A S B S
C
0.3 M
0.1 M C
∅
∅
(SOLDERBALL)
750GX_ds_body.fm SA14-2765-02
September 2, 2005
Dimensions and Signal Assignments
Page 31 of 73
IBM [ IBM ]
