Datasheet
IBM PowerPC 750GX RISC Microprocessor
DD1.X
Figure 4-2. Mechanical Dimensions, ROHS-Compatible Package
Module Subassembly Drawing 32R8317
A01 Corner
(Chip Carrier)
99P0225 (292)
This Side
Module SUB-ASM
3
A J4
5
SAC Solderball
C4 Encapsulant
Fillet
Capacitor
Chip
1
A
D
2
E
A
B
2
1
(21± 0.2)
0.5 ± 0.1
(1.32 MAX)
(1.08 MIN)
(7X)(0.51 MAX)
(7X)(1.83 MAX)
(2.42 MAX)
(21)
19
A01 Corner
(Chip carrier)
B
2
(19X) (1)
2
(0.908 MAX)
(0.779 MIN)
(2.228 MAX)
(1.859 MIN)
(2.828 MAX)
(2.259 MIN)
C
0.2
1
Seating
Plane
C
(1.15 MAX)
(0.45 MIN)
1
C7
VIEW A-A
This Side
(292X) ∅0.7 ± 0.1
A S B S
∅
0.25 M C
∅
0.10 M C
(SAC Solderball)
750GX_ds_body.fm SA14-2765-02
September 2, 2005
Dimensions and Signal Assignments
Page 33 of 73
IBM [ IBM ]
