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IBM25PPC750FL-GR0134T 参数 Datasheet PDF下载

IBM25PPC750FL-GR0134T图片预览
型号: IBM25PPC750FL-GR0134T
PDF下载: 下载PDF文件 查看货源
内容描述: [RISC Microprocessor, 32-Bit, 600MHz, CMOS, PBGA292,]
分类和应用: 外围集成电路
文件页数/大小: 66 页 / 1860 K
品牌: IBM [ IBM ]
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Preliminary  
PowerPC 750FL RISC Microprocessor  
List of Figures  
Figure 1-1. Part Number Legend .............................................................................................................. 13  
Figure 2-1. PowerPC 750FL RISC Microprocessor Block Diagram ......................................................... 14  
Figure 3-1. SYSCLK Input Timing Diagram .............................................................................................. 20  
Figure 3-2. Linear Sweep Modulation Profile ........................................................................................... 21  
Figure 3-3. Input Timing Diagram ............................................................................................................. 22  
Figure 3-4. Mode Select Input Timing Diagram ........................................................................................ 23  
Figure 3-5. Output Valid Timing Definition ................................................................................................ 25  
Figure 3-6. Output Timing Diagram for PowerPC 750FL RISC Microprocessor ...................................... 26  
Figure 3-7. JTAG Clock Input Timing Diagram ......................................................................................... 27  
Figure 3-8. TRST Timing Diagram ........................................................................................................... 28  
Figure 3-9. Boundary-Scan Timing Diagram ............................................................................................ 28  
Figure 3-10. Test Access Port Timing Diagram .......................................................................................... 28  
Figure 4-1. Module Substrate Decoupling Voltage Assignments ............................................................. 29  
Figure 4-2. Mechanical Dimensions and Bottom Surface Nomenclature of the Reduced Lead CBGA  
Package ................................................................................................................................. 30  
Figure 4-3. PowerPC 750FL Microprocessor Ball Placement .................................................................. 31  
Figure 5-1. Single PLL Power Supply Filter Circuit with A1VDD Pin and A2VDD Pin Tied to GND ......... 43  
Figure 5-2. PLL Power Supply Filter Circuit with Two AVDD Pins and One Ferrite ................................. 44  
Figure 5-3. Dual PLL Power Supply Filter Circuits ................................................................................... 45  
Figure 5-4. 750FL Microprocessor Pin Locations: OV , V , GND, and Signal Pins ............................ 47  
DD  
DD  
Figure 5-5. Orientation and Layout of the 750FL Microprocessor Decoupling Capacitors ....................... 48  
Figure 5-6. Driver Impedance Measurement ............................................................................................ 49  
Figure 5-7. IBM RISCWatch JTAG to HRESET, TRST, and SRESET Signal Connector ........................ 55  
Figure 5-8. Thermalloy #2328B Pin-Fin Heat Sink-to-Ambient Thermal Resistance Versus Airflow  
Velocity ................................................................................................................................... 58  
Figure 5-9. C4 Package with Heat Sink Mounted to a Printed Circuit Board ........................................... 59  
Figure 5-10. Exploded Cross-Sectional View of Package with Several Heat Sink Options ....................... 61  
Figure 5-11. Thermal Performance of Select Thermal Interface Materials ................................................. 62  
750flds60LOF.fm.6.0  
April 27, 2007  
List of Figures  
Page 5 of 65  
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