PowerPC 750FL RISC Microprocessor
Preliminary
5.8.2 Internal Package Conduction ................................................................................................. 59
5.8.3 Minimum Heat Sink Requirements ........................................................................................ 60
5.8.4 Heat Sink Mounting ................................................................................................................ 61
5.8.5 Thermal Assist Unit ................................................................................................................ 61
5.8.6 Adhesives and Thermal Interface Materials ........................................................................... 62
5.8.7 Thermal Interface and Adhesive Vendors .............................................................................. 63
5.8.8 Heat Sink Vendors ................................................................................................................. 64
Revision Log .................................................................................................................. 65
Contents
750flds60TOC.fm.6.0
April 27, 2007
Page 4 of 65