DD 2.X
PowerPC 750FX RISC Microprocessor
Preliminary
Note: All electrical specifications (AC, DC, timing) are guaranteed only while the device is operated within
the recommended operating conditions (see Table 3-2). Operation at other application conditions may also
be possible; see the PowerPC 750FX RISC Microprocessor Datasheet Supplement for details.
Table 3-2. Recommended Operating Conditions
Characteristic
Symbol
Value
Unit
V
Notes
1, 2
Core supply voltage (full-on mode)
V
V
1.4 to 1.5
DD
DD
Low Voltage (Low Frequency Operation, 1.8V and 2.5V
bus modes only)
1.2 Minimum
V
1
PLL supply voltage
AV
OV
OV
OV
1.4 to 1.5
1.7 to 1.9
V
V
V
V
V
2
2
2
DD
DD
DD
DD
IN
60x bus supply voltage (1.8V)
60x bus supply voltage (2.5V)
60x bus supply voltage (3.3V)
Input voltage
2.375 to 2.625
3.135 to 3.465
V
GND to OV
0 to 105
2
DD
Die-junction temperature DD2.0 and 2.1
Die-junction temperature DD2.2 and 2.3
Notes:
T
J
J
°C
T
-40 to 105
1. In some cases, when using 1.8v or 2.5v IO mode, it is possible to reduce power dissipation by lowering the core power supply volt-
age. See the Datasheet Supplement for details.
2. These are tested operating conditions.
1
Table 3-3. Package Thermal Characteristics
2
Characteristic
Symbol
Value
0.06
7.6
Unit
°C/W
°C/W
CBGA package thermal resistance, junction-to-case thermal resistance (typical)
CBGA package thermal resistance, junction-to-lead thermal resistance (typical)
θ
JC
θ
JB
Notes:
1. A heat sink is required (see Section 5.8 Thermal Management on page 49).
2. θ is the internal resistance from the junction to the back of the die. For more information about thermal management, see
JC
Section 5.8 Thermal Management on page 49.
3. Electrical and Thermal Characteristics
Page 10 of 63
Body_750FX_DS_DD2.X.fm.2.0
June 9, 2003
IBM [ IBM ]
