Data Sheet
PowerPC® 750CXr RISC Microprocessor
Preliminary
Figure 5-2. Side Profile View of PBGA
A
Dimension Total Package Height (mm)
1.539 +/-0.127
A
Note: Dimension A consists of the entire package with solder balls before reflow.
Figure 5-3. Side Profile View Showing Exposed Cavity
Nickel Plated Surface
A
B
F
D
C
Bond Pads and Solder Mask
E
Item
A
Description
Length (mm)
Height (mm)
0.356 nominal
0.585 +/-0.076
0.58 +/- 0.08
0.47 max
Cu Heat Spreader
27
27
B
Laminate including plating
Solder ball
C
N/A
D
Chip Cavity
15.1 max
N/A
E
Minimum Glop to Solder Ball Height
0.03
F
Cu Heat Spreader, Laminate, Bond Pads, and Plating
N/A
0.955 +/-0.1
PowerPC 750CXr Dimension and Physical Signal Assignments
Page 28 of 43
750cxr_DD4.0_Dev_gen_4_mkt.fm
February 28, 2005
IBM [ IBM ]
