Data Sheet
PowerPC® 750CXr RISC Microprocessor
Preliminary
5. PowerPC 750CXr Dimension and Physical Signal Assignments
IBM offers a plastic ball grid array, PBGA, which supports 256 balls as the PowerPC 750CXr lead free
package. This package is JEDEC MSL-3 and should be handled accordingly.
The following sections contain several views of the package, pin information, and a pin listing.
Figure Description
Figure Number and Page
Shows the pinout of the 256 PBGA package as viewed from the solder ball surface.
Figure 5-1 on page 27
Shows a side profile of the 256 PBGA package including the height from the top of the cop-
per heat spreader to the bottom of the solder balls.
Figure 5-2 on page 28
Figure 5-3 on page 28
Provides a more detailed side profile including the encapsulant (glob) referenced.
PowerPC 750CXr Dimension and Physical Signal Assignments
Page 26 of 43
750cxr_DD4.0_Dev_gen_4_mkt.fm
February 28, 2005
IBM [ IBM ]
