IBM25PPC740-DB0M2500 参数 Datasheet PDF下载

Preliminary Copy

PowerPC 750

TM

SCM RISC Microprocessor

PowerPC 750 Microprocessor Package Description

The following sections provide the package parameters and the mechanical dimensions for the 750.

Parameters for the 360 CBGA Package

The package parameters are as provided in the following list. The package type is 25x 25 mm, 360-lead

ceramic ball grid array (CBGA).

Package outline

Interconnects

Pitch

Minimum module height

Maximum module height

Ball diameter

25 x 25 mm

360 (19 x 19 ball array - 1)

1.27 mm (50 mil)

2.65 mm

3.20 mm

0.89 mm (35 mil)

Mechanical Dimensions of the 360 CBGA Package

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Datasheet

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