PowerPC 405CR Embedded Controller Data Sheet
Absolute Maximum Ratings
The absolute maximum ratings below are stress ratings only. Operation at or beyond these maximum ratings can cause
permanent damage to the device
Characteristic
Symbol
Value
0 to 2.7
0 to 3.6
Unit
1
1
V
Supply Voltage (Internal Logic)
V
DD
OV
Supply Voltage (I/O Interface)
PLL Supply Voltage
V
DD
AV
0 to 2.7
0 to 3.6
V
DD
V
Input Voltage (3.3V LVTTL receivers)
Input Voltage (5.0V LVTTL receivers)
Storage Temperature Range
Case temperature under bias
Notes:
V
IN
V
0 to 5.5
V
IN
T
-55 to 150
-40 to +120
°C
°C
STG
T
C
1. If OV ≥ 0.4V it is required that V ≥ 0.4V. Supply excursions not meeting this criteria must be limited to less than 25ms dura-
DD
DD
tion during each power up or power down event.
Package Thermal Specifications
The PPC405CR is designed to operate within a case temperature range of -40˚C to 120˚C. Thermal resistance values for
the E-PBGA package in a convection environment are as follows:
Airflow
ft/min (m/sec)
Symbol
Parameter
Unit
0 (0)
100 (0.51)
200 (1.02)
Junction-to-case thermal resistance
θJC
θCA
2
2
2
°C/W
°C/W
Case-to-ambient thermal resistance (without heat
sink)
18
16
15
Notes:
1. Case temperature, T , is measured at top center of case surface with device soldered to circuit board.
C
2. T = T – P×θCA, where T is ambient temperature and P is power consumption.
A
C
A
3. TCMax = TJMax – P×θJC, where TJMax is maximum junction temperature and P is power consumption.
4. The above assumes that the chip is mounted on a card with at least one signal and two power planes.
30
IBM [ IBM ]
