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IBM25EMPPC750LCBE4000 参数 Datasheet PDF下载

IBM25EMPPC750LCBE4000图片预览
型号: IBM25EMPPC750LCBE4000
PDF下载: 下载PDF文件 查看货源
内容描述: [RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360]
分类和应用: 时钟外围集成电路
文件页数/大小: 50 页 / 600 K
品牌: IBM [ IBM ]
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PowerPC 740 and PowerPC 750 Embedded Microprocessor  
IBM CMOS 0.20 um Copper Technology EMPPC740L and EMPPC750L  
Chomerics, Inc.  
77 Dragon Court  
Woburn, MA 01888-4850  
617-935-4850  
216-741-7659  
860-571-5100  
609-882-2332  
Thermagon, Inc.  
3256 West 25th Street  
Cleveland, OH 44109-1668  
Loctite Corporation  
1001 Trout Brook Crossing  
Rocky Hill, CT 06067  
AI Technology (e.g. EG7655)  
1425 Lower Ferry Road  
Trent, NJ 08618  
The following section provides a heat sink selection example using one of the commercially available heat  
sinks.  
Heat Sink Selection Example  
For preliminary heat sink sizing, the die-junction temperature can be expressed as follows.  
TJ = TA + TR + (θJC + θINT + θSA) × PD  
Where:  
TJ is the die-junction temperature  
TA is the inlet cabinet ambient temperature  
TR is the air temperature rise within the system cabinet  
θJC is the junction-to-case thermal resistance  
θINT is the thermal resistance of the thermal interface material  
θSA is the heat sink-to-ambient thermal resistance  
PD is the power dissipated by the device  
Typical die-junction temperatures (TJ) should be maintained less than the value specified in Table “Package  
Thermal Characteristics1,” on page 8. The temperature of the air cooling the component greatly depends  
upon the ambient inlet air temperature and the air temperature rise within the computer cabinet. An electronic  
cabinet inlet-air temperature (TA) may range from 30 to 40°C. The air temperature rise within a cabinet (TR)  
may be in the range of 5 to 10°C. The thermal resistance of the interface material (θINT) is typically about 1°C/  
W. Assuming a TA of 30°C, a TR of 5°C, a CBGA package θJC = 0.03, and a power dissipation (PD) of 5.0 watts,  
the following expression for TJ is obtained.  
Die-junction temperature: TJ = 30°C + 5°C + (0.03°C/W +1.0°C/W + θSA) × 5W  
For a Thermalloy heat sink #2328B, the heat sink-to-ambient thermal resistance (θSA) versus air flow velocity  
is shown in Figure 23.  
5/20/99  
Version 1.51  
PowerPC 740 and PowerPC 750 Datasheet  
Page 43  
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